Preliminary Conference
Program
May 19-22, 2005, Hotel Corvinus, Wiener Neustadt, Austria
http://www.isse2005.org/
Local Organization: Applied Electronic
Materials Group
Institute of Sensor and Actuator Systems, Vienna University of Technology
Gusshausstrasse 27-29, A-1040 Vienna, Austria, http://www.isas.tuwien.ac.at
Delegates are
invited to join the welcome reception in the conference hotel, starting at
18:30.
|
17:00 |
CPMT Transactions Editors, Associate Editors, and Guest Editors Chair: Paul Wesling, CPMT Vice President for Publications,
IEEE |
|
18:30 |
IEEE CPMT Regional Promotion meeting Chair: Johan Liu, Chalmers University of Technology, Sweden |
|
08:15 |
Johann Nicolics, Michiel Vellekoop, Vienna University of
Technology, Austria |
|
08:30 |
Processing of Alumina Nano-films (#91) Pavel Mach, Czech Technical University, Prague, Czech Republic |
|
08:55 |
Resonant Tunnel Diode (RTD) Stability (#99) Jim Morris, Portland State University, USA |
|
09:20 |
Engineered Porous Ceramics Using a Directional
Freeze-Drying Process (#103) Peter Gielisse, College of Engineering, Tallahassee, FL, USA |
|
09:45 |
Characterization of Thermally Conductive Epoxy
Nano-composites (#52) Johan Liu, Chalmers University of Technology, Sweden |
|
Sensor for Measuring Load on Wheels of Running Railway
Vehicles (#18) Nencho Nenov, University of Transport, Sofia, Bulgaria |
|
Sensor for Lowest Flow Measurement (#38) Martin Adamek, Brno University of Technology, Brno, Czech Republic |
|
High-Temperature Thermal Converter Based on Thin Film
Ge-Sb-V/TiSi2
Thermocouples (#39) Grażyna Beensh-Marchwicka, Wrocław University of Technology, Wrocław, Poland |
|
Jones Matrix Analysis of a New Magneto-Optic Angular
Displacement Sensor (#42) Hans Hauser, Vienna University of Technology, Vienna, Austria |
|
MCM Low - Cost True Time Delay Phase Shifter (#43) Bojidar
Avdjiiski, MMIC
Department, RaySat BG, Sofia, Bulgaria |
|
PSoC Dual Sensor for Pressure
and Temperature Using Bipolar Junction Effects (#50) Marius
Muresan, Technical University of Cluj-Napoca, Cluj-Napoca, Romania |
|
An Accurate Method for Measuring Resistive Transducers
from Hydro-Energetic Constructions (#75) Septimiu
Pop, Technical University of Cluj-Napoca, Cluj-Napoca, Romania |
|
Chemo-Optical Sensor for Toxic Gases Detection (#76) Ciprian Ionescu, Politechnica University Bucharest, Bucharest,
Romania |
|
Implementation of Microcontrollers in Railway
Automatic Traffic Control Systems (#78) Margarita Georgieva, University of Transport, Sofia, Bulgaria |
|
Calibration of a Thin Film Sensor for Transepidermal
Water Loss Measurement (#96) Martin Mündlein, Vienna University of Technology, Vienna, Austria |
|
Synchronization Measurements of a Polarization
Independent Magneto-Optical Switch (#111) Yuri Didosyan, Vienna University of Technology, Vienna, Austria |
|
11:15 |
Present Status of Transition to Pb-Free
Soldering (#84) Zsolt Illyefalvi-Vitéz, Budapest
Univ. of Technology and Economics, Budapest, Hungary |
|
11:40 |
Lead Free Soldering Material Compatibility and Technological Factors (#20) Jiří Starý, Brno
University of Technology, Brno, Czech Republic |
|
12:05 |
Influence of Flux Activity on Process Parameters and Solder Joints in
Lead-free Wave Soldering (#37) Janusz Sitek, Tele and Radio Research Institute, Warsaw, Poland |
|
12:30 |
Incompatibility Problems in Soldering Technology (#45) László Tersztyánszky, Budapest
University of Technology and Economics, Hungary |
|
12:55 |
Wave Soldering Process for Lead Free Solders – A
Modelling Study using Computational Fluid Dynamics (#120) School of Computing and Mathematical Sciences,
University of Greenwich, London, UK |
|
Finite Element Modeling of Surface Mount Devices (#21) Marek Novotny, Brno University of Technology, Brno, Czech
Republic |
|
Mechanical Cycling in
Accelerated Life-Time Tests of Lead-Free Soldered Joints (#27) Zdzislaw Drozd, Warsaw University of Technology, Warsaw,
Poland |
|
Design of Antireflection
Wideband Coatings for the Near Infrared Spectral Region (#34) Tamara Pencheva, University of Russe, Russe, Bulgaria |
|
Heat Transfer Modeling for Soldering Processes of SMDs
to Printed Circuit Boards Using Low Inert Infrared Heaters (#35) Tamara Pencheva, University of Russe, Russe, Bulgaria |
|
Thermal Simulation of a High Power Loudspeaker (#41) Ciprian Ionescu, Politehnica University of Bucharest,
Bucharest, Romania |
|
Temperature Field Simulation of Thick-Film
Microcircuits using Finite Element Method (#60) Dariusz Klepacki, Rzeszów University of
Technology, Rzeszów, Poland |
|
Simulating the Contact Formation in Isotropically
Conductive Adhesives (#86) Martin Mündlein, Vienna University of Technology, Vienna, Austria |
|
Evaluation of Lead-free Solder / Flux / Metallization
Systems by Means of Modified Wettability Tests (#90) Bruno Balluch, Vienna University of Technology, Vienna, Austria |
|
Hysteresis Calculation for Thin Film Multi-Layers
Nanostructured by Ion Irradiation (#97) Diyar Bajalan, Vienna
University of Technology, Vienna, Austria |
|
Thermal Simulation and Characterization of AlGaN/GaN/Si High Electron Mobility Transistors (#98) Gernot Hanreich, University of Applied Sciences for Building Technology
and Management, Pinkafeld, Austria |
|
Use of the Dynamic Heterogeneities for Creation of
Temporary Operating Conductive Tracks (#106) Borys Tsyganok, Kyiv Polytechnic Institute, Kyiv, Ukraine |
|
Demonstration of a Slipstream Simulation Flow
Including Device and Circuit Simulators (#110) George Angelov, Sofia Technical University, Sofia, Bulgaria |
|
15:30 |
New Application of LTCC
Technology (#67) Leszek Golonka, Wroclaw University of
Technology, Wroclaw, Poland |
|
15:55 |
SMT GOES GREEN:
Investigations on and Optimization of Lead-Free Solder Pastes using Wetting
Tests, Solder Balling Tests and Screen Printing Tests with Simulated Process
Breaks (#11) Markus Detert, Centre of
Microtechnical Manufacturing, Dresden, Germany |
|
16:20 |
Ceramic Patch Antenna
for High Temperature Applications (#102) Robert Hauser, Carinthian
Tech Research, Villach, Austria |
|
16:45 |
LTCC Resistors and Resistive Temperature Sensors –
Chosen Electrical and Stability Properties (#64) Andrzej Dziedzik, Wroclaw
University of Technology, Wroclaw, Poland |
|
17:10 |
A Novel Approach to Electronic Nose-Head Design, Using
a Copper Thin Film Electrode Patterning Technique (#105) Khalil Arshak, University
of Limerick, Ireland |
|
The Effect of Lead Free
Soldering on Formation of Black Pad Failure (#13) Oliver Krammer, Budapest University of Technology and
Economics, Budapest, Hungary |
|
Laser Structuring of
Fine Line Printed Circuit Boards (#23) Wojciech Falinski, Tele and Radio Research Institute, Warsaw,
Poland |
|
Technology Downscale for
Optical Waveguides in Cost Performance Electrical-Optical Circuit Boards (#32) Krzysztof Nieweglowski, Technische Universität Dresden, Dresden, Germany |
|
Electrically Conductive
Adhesives as Vias Fill in PCBs: The Influence of Fill Shape and Contact
Metallisation on Vias Resistance Stability (#48) Ryszard Kisiel, Warsaw University of Technology, Warsaw, Poland |
|
System on Chip Design
for Multiple Output Switching Regulators (#49) Gabriel Chindris, Technical University of Cluj-Napoca,
Cluj-Napoca, Romania |
|
An Investigation into EMC
Emission from SEPIC Based Switch Mode Power Supply in Discontinuous
Conduction Mode (#54) Gabriel Chindris, Technical University of Cluj-Napoca, Romania |
|
The Simplified Control
Unit of Matrix Converter (#57) Tomasz Binkowski, Rzeszow University of Technology, Rzeszów,
Poland |
|
FPGA Implemented
Decimating Filter (#62) Ioan Lie, "Politehnica"
University of Timisoara, Timisoara, Romania |
|
Active Gate Drivers (#68) Dariusz Sobczyński, Rzeszów University of Technology,
Rzeszów, Poland |
|
GSM Solutions for Low
Cost Embedded Systems for Industrial Control (#73) Andrei Drumea, "Politehnica" University of
Bucharest, Bucharest, Romania |
|
A Cost Efficient
Solution for an Integrated Random Number Generators (#74) Camelia Popescu, "Politehnica" University of
Bucharest, Bucharest, Romania |
|
08:15 |
Nonlinear Discrete Elements in Electro-Thermal Model
of Thick-Film Structure (#61) Dariusz Klepacki, Rzeszów University of
Technology, Rzeszów, Poland |
|
08:40 |
Optimization of Virtual
Investigation Methods in Thermal Management of Electronic Assemblies (#63) Norocel Codreanu, "Politehnica" University of Bucharest,
Romania |
|
09:05 |
Investigation Concept
for Determining Fatigue Casuals and Lifetime Prediction for SnAgCu Base Solder Joints (#16) Mike Roellig, Dresden University of Technology, Dresden, Germany |
|
09:30 |
Porosity in Lead-Free Sn95.5Ag3.8Cu Solder Joints with Cu-
and Ag-Pad Metallization (#88) Walter Gschohsmann, Vienna University of Technology, Vienna, Austria |
|
09:55 |
Heat Sink Materials
with Tailored Properties for Thermal Management (#100) Erich Neubauer, ARC seibersdorf research GmbH, Seibersdorf,
Austria |
|
11:30 |
A Model of
Low-Frequency Noise in Ru-based Low Temperature Sensors (#59) Andrzej Kolek, Rzeszów University of
Technology, Rzeszów, Poland |
|
11:55 |
Error Reducing
Techniques for the Scattering Parameter Characterization of Differential
Networks Using a Two-Port Network Analyzer (#79) Michael Caggiano, Rutgers University, Piscataway, NJ, USA |
|
12:20 |
Noise Behavior of
Elementary Transconductors Stages in Bipolar and CMOS Technology (#40) Vlad Cehan, "Gh. Asachi" Technical University,
Iaşi, Romania |
|
An Investigation of the Development of the Conductive
Phase in some Thick-Film Resistors (#19) Marko Hrovat, Jožef Stefan Institute, Ljubljana,
Slovenia |
|
LTCC Based Microfluidic Optical Detector (#51) Karol Malecha, Wroclaw University of Technology, Wroclaw, Poland |
|
Fluidic Micromixer Made
in LTCC Technology – Preliminary Results (#53) Grzegorz Ostromecki, Wroclaw University of Technology, Wroclaw, Poland |
|
Thermally Activated
Noise Sources in Thick Film Resistors of RuO2 and Glass (#56) Adam Stadler, Rzeszów University of Technology,
Rzeszów, Poland |
|
Nonlinear Microscopic
Fluctuators in Ru-Based Thick Film Resistors (#58) Andrzej Kolek, Rzeszów
University of Technology, Rzeszów, Poland |
|
Characterization
of a Calorimetric Flow Sensor Built Up in Thick-Film Technology (#87) Deniz Güleryüz, Vienna University of Technology, Vienna, Austria |
|
Characterization of a
Piezoresistive Torque Sensor Built Up in Thick Film Technology (#89) Hannes Hochstöger, Vienna University of Technology, Vienna, Austria |
|
Radiation Effects in
Electrical and Optical Properties of In2O3/SiO Thick Films (#94) Khalil Arshak, University of Limerick, Limerick, Ireland |
|
Radiation-Induced Changes in the Electrical Properties
of TiO2 Thick Films (#95) Khalil Arshak, University of Limerick, Limerick, Ireland |
|
Chosen Electrical and
Reliability Properties of Thick Film Photoimageable Components (#101) Alena Pietriková, Technical University of Kosice, Kosice, Slovakia |
|
08:30 |
Physical Design and Technology Parameters
for Vertical System-In-Package Integration (#82) David Polityko, Technical University Berlin, FSP Mikroperipherik,
Berlin, Germany |
|
08:55 |
Apparatus and Method for Soldering
Electronic Components to Printed Circuit Boards (#36) Tamara Pencheva, University of Rousse, Bulgaria |
|
09:20 |
Simulation and Indirect Measurement of
Temperature Change in Polyimide Induced by Laser Ablation at 355 nm (#44) Bálint Balogh, Budapest University of Technology and Economics,
Budapest, Hungary |
|
09:45 |
Integrated Enterprise
Resource Planning Systems (#65) Peter Martinek, Budapest University of Technology and Economics,
Budapest, Hungary |
|
Reliability
Analysis in Microelectronic Packaging by Acoustic Microscopy (#7) Klaus-Jürgen Wolter, Dresden University of Technology, Dresden, Germany |
|
Statistical Modeling
and Simulation of SMD-Mounting Process (#10) Heinz Wohlrabe, Dresden University of Technology, Dresden, Germany |
|
Best Quality Strategy
for Electronics Production (#12) Martin Oppermann, Dresden University of Technology, Dresden, Germany |
|
Displacement Measurement Method for
Advanced Electronic Packaging (#22) Joanna Skiba, Wroclaw University of Technology, Wroclaw, Poland |
|
X-Ray Inspection of
Microwire Bonds (#24) Robert Kovacs, Budapest University of Technology and
Economics, Budapest, Hungary |
|
Measurement Method for Placement Capability
of Wedge-Wedge Wire Bonding Process (#26) Soeren Krille, University of Applied Sciences, Dresden,
Germany |
|
Testing of a Signal
Synthesis Module Using LabVIEW Software (#46) Daniel Alexandru Visan, University of Pitesti, Pitesti,
Romania |
|
LabVIEW Application for Analysis of
Mechanical Vibrations from Industrial Environment (#47) Daniel Alexandru Visan, University of Pitesti, Pitesti,
Romania |
|
Frequency Exchanger from Electronic Telemetering
Equipment of Movement Features (#55) Mihail Eugen Tănase, "Politehnica" University of
Timişoara, Romania |
|
Ellipsometry and Thin
Films Parameters Measurement (#72) Ivanka Kalimanova, Technical University, Sofia, Bulgaria |