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TOPICS OF INTEREST
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- A Sub-micron technology: nanomaterials and nanoelectronics
B Thermal management, reliability physics, and life time-prediction in electronics
C Quality assurance: destructive and non-destructive testing
D New packaging materials and concepts for special application fields
(e.g. medical, transport, automotive, robotics, optoelectronics, sensors and actuators)
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E System on chip, system in package
F Manufacturing processes and process simulation
G Electromagnetic compatibility and signal integrity analysis
H Innovations in printed circuit board, thin film and thick film techniques
I Environmental Issues: Ecology and toxicology; life cycle analyses
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